Winbond new generation W25Q01NW serial flash memory

Winbond has just launched a new generation of serial Flash memory, W25Q01NW. The product is designed specifically for systems with limited space, pins and power with Serial Flash memory devices providing a powerful storage solution that far exceeds the capabilities of conventional devices.

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This makes it possible to monitor code into RAM, execute code directly from Dual/Quad SPI (XIP), or store voice, text, and data flexibly and efficiently. The W25Q01NW operates on a single 1.7V to 1.95V power supply, ensuring optimal performance while maintaining power consumption at 0.4µA during power off, ensuring energy savings for all system. Unique memory organization, including two 512MB stacked dies supporting up to 1GB of memory. With all the above advantages, W25Q01NW is the perfect product for applications in embedded systems, IoT, electronic devices and automotive systems. 


  • Highest performance serial flash: 

– Continuous data transfer speed of 66MB/S 

– Minimum program deletion cycle 100K 

– Retain data for more than 20 years 

  • Low power, wide temperature range 

– Single source 1.7V to 1.95V 

– <0.4µA Power off (typical) 

– Operating range -40°C to +85°C /105°C 

  • Advanced security features 

– Software and hardware write protection 

– Lock the power source 

– Protect special OTP 

– Protect individual Block/Area arrays 


  • Dimensions: 8.1 x 6.1 x 0.8 mm 
  • Operating temperature: -40°C to +85°C /105°C 
  • Single source 1.7V to 1.95V 
  • Communication standards 

– SPI standard: CLK, /CS, DI, DO 

– Dual SPI: CLK, /CS, IO0, IO1, 

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 


  • Embedded System 
  • IoT devices 
  • Consumer electronics 
  • Automotive systems 

​Learn more at: W25Q01NW

Contact EPI Vietnam Technologies – the authorized distributor of Winbond in Vietnam for technical support and samples.