ELECTRONICS NEWS HIGHLIGHT W12.2024

1. Korea – Semiconductor exports increased 21.7% over the same period in the first 10 days of March

According to a report from the Korea Customs Department, South Korea’s exports in the first 10 days of March 2024 decreased by 13.4% over the same period to 13.54 billion USB, of which semiconductor exports increased by 21.7% compared to the same period last year in the same period last year.

In addition, Korean industry said investment in equipment increased 4.1% year-on-year in January this year. In particular, the index of specialized machinery and equipment closely related to investment and semiconductor production increased sharply over the same period last year from -11.3% to 12.7%.

Learn more: South Korea’s chip exports increased 21.7% year-on-year in the first 10 days of March

2. Silicon Box builds a chiplet factory in Italy

According to Italian Industry Minister Adolfo Urso, Silicon Box will invest 3.2 billion euros in Italy to build a packaging factory in northern Italy.

“Recent global upheavals highlight the need to build more resilient supply chains for semiconductors in Europe,” Urso said. The move comes after negotiations between Intel and the Italian government about building a packaging plant in the country failed.

Silicon Box states: “We are ready to meet the semiconductor industry’s challenges in rapid chiplet adoption. State-of-the-art factory construction and advanced panel-level packaging are providing scale-up solutions for high-growth markets. This is our first billion-dollar factory and we look forward to scaling rapidly to support our customers and partners.”

The company claims to have the shortest chiplet-to-chiplet connection, reducing manufacturing costs by up to 90% for high-performance devices, with better thermal and electrical performance, which is especially important for the market. AI accelerators are growing.

Learn more: Silicon Box to build chiplet plant in Italy

3. Infineon cooperates with Honda

According to the latest information from Honda, Infineon and Honda recently signed a Memorandum of Understanding to cooperate in the fields of power semiconductors, ADAS and E/E architecture, in which both parties will collaborate on new architecture concepts.

Infineon will become Honda’s semiconductor partner to align future technology and product roadmaps. Both companies agreed to continue discussions on supply stability as well as encourage mutual knowledge transfer and collaboration on projects to accelerate technology time to market.

“Strengthening long-term partnerships is always a confirmation of the added value created,” said Peter Schiefer, President of the Automotive Division at Infineon.