ELECTRONIC NEWS HIGHLIGHT W10.2025

1. TSMC’s CoWoS will reach 75000 wafers/month by the end of 2025

TSMC will continue expanding its advanced CoWoS packaging capacity over the next five years, aiming to increase output to 75,000–80,000 wafers per month by the end of 2025 and reach 150,000 wafers per month by 2028–2029.

The expansion will proceed in phases. By the end of 2024, CoWoS capacity is expected to exceed 35,000 wafers per month, with around 20,000 wafers for CoWoS-S, 10,000–15,000 wafers for CoWoS-L, and limited production for CoWoS-R. In 2025, CoWoS-S is expected to exceed 20,000 wafers, CoWoS-L to reach 45,000 wafers, and CoWoS-R to increase to 10,000 wafers per month.

Despite competition from low-cost AI firms like DeepSeek and concerns over high-priced hardware from Nvidia, demand for AI GPUs and CoWoS packaging remains strong. Analysts expect TSMC’s expansion roadmap to stay on track, reinforcing its leadership in advanced packaging.

Learn more: TSMC’s CoWoS will reach 75000 wafers/month by the end of 2025

2. Yageo acquired Shibaura Electronics for NT$14 billion

Yageo Group said that it will acquire Japan-listed Shibaura Electronics in a deal valued at about NT$14 billion (Japanese yen 65.56 billion), a move aimed at strengthening its sensor business and expanding the company’s global footprint.

Under the proposed terms, Yageo will buy 100% of Shibaura’s shares at a price of 4300 yen per share—about 36.94% higher than Shibaura’s closing price of 3140 yen. The acquisition is expected to commence on May 7, subject to regulatory approvals and customary closing conditions. Even if the total number of shares offered does not reach the planned 15.2462 million shares, the deal will proceed on the condition that at least 7.6231 million shares 50% of the target are offered.

Yageo said the acquisition will leverage its global distribution network to enhance Shibaura’s market reach, especially in North America and Europe, and will support enhanced R&D efforts to maintain its technological edge in sensing applications. The move is expected to improve Yageo’s earnings per share and net asset value over time.

Learn more: Yageo acquired Shibaura Electronics for NT$14 billion

3. Japan’s semiconductor sales soar 44.7% by December 2024

According to the latest data from the Semiconductor Association of Japan (SEAJ), semiconductor equipment sales in Japan skyrocketed 44.7% in December 2024, reaching 4,433.64 billion Yen (about 28.8 billion USD) according to the three-month moving average, including exports. This is the largest increase in 34 months and the 14th consecutive month that sales exceeded 3000 billion Yen (about 19.5 billion USD), setting a new historical record.

For the whole of 2024, Japan’s semiconductor equipment sales reached 4,435.59 billion Yen (about 28.9 billion USD), up 22.9% compared to 2023. This performance far exceeds the 3,851.69 billion Yen (about 25 billion USD) recorded in 2022, setting an all-time high. Japan’s global market share of semiconductor equipment, based on sales, currently stands at 30%, second only to the United States.

The SEAJ forecast report attributed the strong sales growth to growing investments by both established and emerging companies in China, as well as growing demand for advanced semiconductor manufacturing driven by AI-related technologies. The association predicts that semiconductor equipment sales in fiscal 2024 (April 2024 – March 2025) will increase 20%, marking the first time Japan’s sales will exceed 4 trillion yen (about 26 billion USD).

According to the Association of Semiconductor Manufacturers International (SEMI), global semiconductor sales are expected to grow 6.5% by 2025, reaching a record high of $113 billion.