T-Global - TG-A1660 Super soft heatsink for CPU,MCU

The TG-A1660 super soft heatsink product line from Tglobal with the ability to dissipate heat for CPUs, MCUs or chips operating in high temperature environments. 

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The super soft heatsink TG-A1660 has thermal conductivity up to 16.6 W/mk. The TG-A1660 is highly versatile and is offered in standard sheets or custom die-cut parts.   

T-Global’s heatsink offers compression resistance and very good adhesion. With a thickness of only about 0.5 – 2 mm, TG-A1660 will not affect any space on the circuit while still ensuring good heat dissipation quality.  

Additionally, the wide operating temperature range from -50*C to 180*C, provides low thermal impedance for the most demanding applications. TG-A1660 is the perfect product for applications such as electric vehicles, consumer devices, industry, medical, military, etc. 


– Thermal conductivity coefficient: 16.6 W/mk 

– Thickness: 0.5 – 2 mm 

– Operating temperature: -50*C – +180*C 

– Hardness: 65 shore OO 

– Dielectric breakdown voltage: 7 kV/mm 


– Super soft heatsink 

– Ultra Soft 

– High thermal conductivity coefficient 

– Low impedance 

– Works well in harsh environments 


– Electric mo torbikes, electric cars 

– Consumer equipment 

– Medical 

– Military 


Learn more: TG-A1660

Contact EPI Vietnam Technologies – the authorized distributor of T-Global in Vietnam for better support on products and prices.