T-Global - TG-A1660 Super soft heatsink for CPU,MCU
The TG-A1660 super soft heatsink product line from Tglobal with the ability to dissipate heat for CPUs, MCUs or chips operating in high temperature environments.
![](https://epi-tech.com.vn/wp-content/uploads/2024/07/2-1-768x428.png)
The super soft heatsink TG-A1660 has thermal conductivity up to 16.6 W/mk. The TG-A1660 is highly versatile and is offered in standard sheets or custom die-cut parts.
T-Global’s heatsink offers compression resistance and very good adhesion. With a thickness of only about 0.5 – 2 mm, TG-A1660 will not affect any space on the circuit while still ensuring good heat dissipation quality.
Additionally, the wide operating temperature range from -50*C to 180*C, provides low thermal impedance for the most demanding applications. TG-A1660 is the perfect product for applications such as electric vehicles, consumer devices, industry, medical, military, etc.
Specifications:
– Thermal conductivity coefficient: 16.6 W/mk
– Thickness: 0.5 – 2 mm
– Operating temperature: -50*C – +180*C
– Hardness: 65 shore OO
– Dielectric breakdown voltage: ≥ 7 kV/mm
Advantages:
– Super soft heatsink
– Ultra Soft
– High thermal conductivity coefficient
– Low impedance
– Works well in harsh environments
Applications:
– Electric mo torbikes, electric cars
– Consumer equipment
– Medical
– Military
-Industry
Learn more: TG-A1660
Contact EPI Vietnam Technologies – the authorized distributor of T-Global in Vietnam for better support on products and prices.