T-Global - TG-AD66: Ultra Soft Thermal Pad for Laptop

The TG-AD66 Ultra Soft Thermal Pad is specially designed for high-performance electronic applications such as servers, networking equipment, cloud computing, and high-speed data processing systems. This thermal pad offers a thermal conductivity of up to 6.5 W/m·K, enabling rapid heat transfer from components (ICs, CPUs, GPUs, etc.) to the heat sink, preventing overheating and ensuring device performance and longevity.

Additionally, with a hardness of only 20 Shore OO, the TG-AD66 is extremely soft and flexible, allowing it to fill microscopic gaps between contact surfaces without requiring excessive pressure. This makes it ideal for thin circuit boards or fragile components.

Moreover, the TG-AD66 provides optimized compressibility and excellent compression, maximizing the contact area with components, thereby reducing thermal resistance to as low as 0.01 °C·in²/W. With a volume resistivity of ≥ 10¹² Ohm·m, the TG-AD66 prevents electrical leakage, offering maximum protection for sensitive components.

Specifications: 

– Thermal conductivity: 3.0–6.5 W/m·K 

– Hardness (Shore OO): 20 

– Thickness: Optional from 0.5 to 8.0 mm 

– Operating temperature: -50 to +150 °C 

– Fire resistance: UL 94 V-0 

– Volume resistivity: ≥10¹² Ohm·m 

Advantages: 

– High thermal conductivity – Instant Heat Transfer 

– Absolute softness – easy to mount 

– Optimal compression – minimize thermal resistance 

Applications: 

– Server systems, data centers 

– Telecommunication network equipment, 5G stations 

– AI/ML applications, signal processing boards 

– Electric vehicles and electronic devices in cars 

– High-end consumer devices (smartphones, laptops, smart homes…) 

Learn more: TG-AD66

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