ELECTRONICS NEWS HIGHLIGHST 11/15/2021

ELECTRONICS NEWS HIGHLIGHST 11/15/2021

1. AMKOR TECHNOLOGY ANNOUNCES PLANS TO BUILD NEW FACTORY IN BAC NINH, VIETNAM

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. The first phase of the facility is estimated to be between $200 million - $250 million, and focus on providing Advanced System in Package (SiP) assembly and test solutions to the world’s leading semiconductor and electronic manufacturing companies. high-volume manufacturing is expected to begin by the second half of 2023

Details: https://ir.amkor.com/news-releases/news-release-details/amkor-technology-announces-plans-expand-advanced-packaging

2. TOSHIBA TO SPLIT INTO 3 COMPANIES BY 2023

After a series of crises within the company, and under pressure from shareholders, Board of Management of Toshiba has announced to split into 3 companies in 2023. All three units would focus on solid state infrastructure, devices and memory.

Details: https://asia.nikkei.com/Spotlight/Toshiba-in-turmoil/Toshiba-to-split-into-3-companies-by-2023

3. APPLE TRIMS IPAD PRODUCTION TO FEED CHIPS TO IPHONE 13

Even using the same chip between iPad and iPhone 13, but the iPhone is the first-priority of Apple strategy business. iPad has been cut 50% production plan and reducing production of older iPhone models to prioritize the iPhone 13 lineup.

Details: https://9to5mac.com/2021/11/01/apple-reportedly-cuts-ipad-production-to-increase-iphone-shipments/

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